What's New! News New Devices Events			View Cart ()   Checkout   MySI Account   New Devices A summary of innovative new devices we're analyzing  New Devices RSS Feed All New Devices Analog / Mixed Signal Logic Memory Process Wireless Samsung 1G DDR2 SDRAM This is the latest 1Gbit DDR2 SDRAM from the manufacturer using the 56nm DRAM process technology. Hynix 1G DDR2 DRAM This is the latest 1Gbit DDR2 SDRAM from the manufacturer using the 54nm DRAM process technology. Qualcomm Snapdragon Mobile Processor The Qualcomm Snapdragon allows the mobile device vendors to escalate the latest handset market trend to enable laptop experience on handsets. It leads the industry in functionality, performance, power efficiency and footprint. Toshiba 16G 43nm MLC NAND Flash The new architecture, ABL (All BitLine architecture), achieves higher program and read throughput by activating both even & odd bitline simultaneously. Reduced supply voltage for the I/O buffer helps integrating this product with chips in a system Broadcom IEEE 802.11a/b/g MAC/BASEBAND/RADIO w/ Bluetooth 2.1 + EDR AND FM Receiver As evidenced in the Apple iPod Touch 2nd generation design win, BCM4325 provides all the connectivity functions today’s mobile products to enhance user experience. To receive an annotated Image of the iPhone 3G PCB, email simonel@semiconductor.com. Hynix 1G DDR3 Synchronus DRAM The smaller process node offers substantial benefits, lower power consumption, heat dissipation and cost to manufacture. The die size is only 7% larger, helping DDR3 DRAM reach a competitive price point to become mainstream in the marketplace Intel SILVERTHORNE Intel Atom Processor The 45nm Intel® Atom™ processors pack an astounding 47 million transistors on a single chip measuring less than 26mm², making them Intel's smallest and lowest power processors. All this while delivering the power and performance you need STMicroelectronics Low Power 3-axis Accelerometer The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface. Qualcomm Applications Processor Qualcomm MSM7201A's new capabilities include; an integrated ARM11-based application processor, high-speed HSDPA/HSUPA wireless connectivity, blazing fast WVGA video performance and stunning 2D & 3D graphics acceleration Texas Instruments OMAP3530 Baseband Applications Processor The heart of this new device is the ARM Cortex along with the other major subsystems. Die utilization has improved dramatically allowing TI to substantially increase performance, while achieving a 30% die area reduction compared to the 90nm OMAP2420 Apple (Samsung S5L8900) applications processor with eDRAM The Samsung S5L8900 is an applications processor found in the Apple iPhone. It was found with in an Apple marked package. It contains embedded DRAM and an innovative package on package design. Spansion 2G 65nm MirrorBit ORNAND The Spansion 65nm 2Gb MirrorBit ORNAND is an important step for the organization. It continues their commitment to deliver a process lithography shrink every year for the past 3 years. Hynix 8G MLC NAND Flash (57nm process node technology) Hynix’s 57nm 8Gb MLC NAND Flash has an extra interconnect layer increasing the mask count number. They have also implemented a new die floor plan, with a one-sided pad arrangement and a one-sided buffer arrangement to help reduce the die area used. Sony Computer Entertainment Inc. CELL BROADBAND ENGINE ™ Cell Broadband Engine The Sony PlayStation 3 is one of the three recent gaming systems available in the market. The PS3 has leverage the high level of technical capabilities that the system offers. The Cell Processor largely drives these capabilities. Samsung 1G 68nm DDR2 SDRAM The 68nm device from Samsung is the smallest process lithography DRAM from Samsung analyzed by Semiconductor Insights to date with a 13.7Mb/mm2 rating. IM Flash Technologies 16G MLC NAND Flash While it has been over a year since the previous 4Gb SLC NAND Flash from IM Flash Technologies entered the market, the company maintains the smallest process lithography at this time, measuring only 50nm. Hynix 1G DDR2 SDRAM The 66nm device from Hynix is the smallest DRAM process component analyzed by SI to date. Smaller process geometries help to reduce power consumption in the chip enabling less heat produced, lower cooling costs, and quieter system operation. Spansion 2G MirrorBit Quad Flash The first NOR flash from Spansion to use MirrorBit Quad technology – an architecture that stores four-bits-per-cell. MirrorBit Quad doubles the density of MirrorBit with the added ability to store different charge states in each of the two locations. Qualcomm MSM7200 Chipset solution for WCDMA (UMTS)/HSUPA and GSM/GPRS/EDGE The Qualcomm MSM7200 is designed for wireless mobile applications, such as cell phones, providing all of the features that these systems require from connectivity, camera support, GPS, and multimedia playback. Intel Penryn 45nm Processor Intel’s 45nm Penryn processor is an engineering milestone, with a small process lithography and high K gate dielectrics. Intel claims this can deliver >20% increase in transistor switching speed and reduce transistor gate leakage by over 10X. Panasonic 45nm UniPhier system LSI To achieve a 45nm process node Matsushita has used 193nm immersion lithography, stress-induced mobility-enhanced transistors, low-k dielectrics and design-for-manufacturability technologies. Marvell Semiconductor 802.11 a/b/g RF IC Transceiver The Marvell 88W8686, found in the Apple iPhone, integrates an ARM-compliant CPU, high-speed serial host interfaces including SDIO and SPI, and advanced 802.11 a/b/g RF transceiver with full cellular coexistence. Hynix 8G 60nm NAND Flash The latest NAND Flash product offered by Hynix is in their 60nm process technology. The HY27UT088G2M is 8Gb MLC NAND Flash. UPEK Touchstrip® Fingerprint Authentication Solution Touchstrip® Fingerprint Authentication Solution consists of a TouchStrip Fingerprint Sensor (TCS3) and the Digital ID Hardware Engine (TCD42) IC for a biometric solution that guards against peripheral and PC hacking attempts. Analog Devices AD9923 CCD Signal Processor with V-Driver and Precision Timing™ Generator Developed for digital still cameras, the AD9923 is a complete solution featuring an integrated 15-channel V-driver, a 12-bit 36Mhz analog-to-digital converter and an on-chip timing generator. Qualcomm RFR6202 Receiver A component in Qualcomm's radioOne RF solution, the RFR6202 receiver works to support Dual-band WCDMA (UMTS). Operating at UMTS 800 and 2100MHz, the RFR6202 works with the RFL6202 and RTR6250 to complete the radioOne solution. DENSO MANUFACTURING Toyota Prius (2006) Airbag Control Module The Toyota Prius airbag control module controls the airbag system and communicates to the airbag on when to activate. This module features many parts of interest from companies like Denso, ST Microelectronics, Renesas and Seiko. NXP Semiconductors TV Tuner NXP's TDA6650 is a single-chip mixer/oscillator & low phase noise PLL synthesizer for tuners dedicated to hybrid and pure digital applications. This tuner is used in digital/analog terrestrial and cable tuners, digital TV sets and set-top boxes. Balda Multi-point touch screen for use in the Apple iPhone Designed by Balda for use in the Apple iPhone, this is a rugged touch screen that uses multi-point technology in conjunction with Apple's GUI. Maxlinear MXL5005 Terrestrial Tuner Developed by MaxLinear, the MxL5005 is a global standards silicon tuner developed for applications such as mobile devices, laptops, set top boxes and automotive applications like telematics. Sony ICX629 Image Sensor High-Resolution Diagonal 7.208 mm (Type 1/2.5) 7.24M-Effective Pixel Digital Still Camera CCDs for Consumer Products Support VGA Resolution Moving Picture Imaging Infineon S-Gold 2 Multimedia Engine with Advanced EDGE Functionality S-GOLD2 combines EDGE modem technology with the multimedia functions for mobile phone applications. Samsung 1G DDR3 SDRAM Samsung's 80nm DDR3 DRAM cell is an 8F2 cell with a metal-insulator-metal (MIM) capacitor. It uses a spherical recess-access transistor with a gate length of 47nm. The wordline width/pitch are 47nm/165nm, with a bitline width/pitch are 40nm/160nm. Zoran COACH9 Digital Camera Processor The Coach 9 includes several on-chip features, and firmware capabilities that enable applications such as picture-in-picture, audio annotation, and sound effects. Texas Instruments 65nm Digital Signal Processor The TMS320TCI6488 (TCI6488) device is a very high-performance DSP designed specifically for WCDMA wireless infrastructure baseband applications. Qualcomm Transceiver Qualcomm’s RTR6285 is the first single-chip UMTS radio-frequency (RF) CMOS transceiver with receive diversity and GPS. In addition, the multi-band UMTS and quad-band EGPRS features allow for global roaming. Qualcomm QSC6010 Single Chip RF transceiver, Baseband, and power management for CDMA2000 The QSC6010 is designed for Qualcomm’s Value Platform that supports 3G CDMA2000 1X wireless with backwards compatibility with 2G standards. This solution features three die - RF, baseband processor and power management chip - in a single package. Micron Technology 1G 78nm DDR3 SDRAM Insight Award Winner (2007) - Most Innovative DRAM Micron’s 78nm 1Gb DDR3 ties with Qimonda as the first DDR3 devices that Semiconductor Insights has analyzed to date. Qualcomm MSM7500 Convergence Platform Baseband Applications Processor The MSM7500 is a 90nm process dual-CPU Convergence Platform single-chip solution which provides processing capacity to match the high data-speed capabilities of CDMA2000 1xEV-DO Rev A networks. Hynix 512M 80nm DDR2 SDRAM The Hynix HY5PS12821C 512Mb DDR2 SDRAM has a die size 56mm2. The device is fabricated in a three metal, four poly stacked capacitor DRAM process employing recessed channel array transistors similar to the RCAT developed by Samsung. Samsung 512M 80nm Rev ''E'' DDR2 SDRAM Samsung continues its DRAM dominance with a bit density of 10.9Mb/mm2. 6F2 cell design along with the next generation of trench channel access transistor – SRCAT – provides Samsung the smallest cell size ever recorded at 0.0375 square microns. Kaneka Thin-Film Silicon Photovoltaic Module (Solar Panel) Kaneka Silicon PV's generated watt-power is approximately same as that of other crystalline silicon PVs during the winter months, but in summer the Kaneka Silicon PV generates significantly more power compared to other crystalline silicon PVs. Recently Published Moving up to DDR2 at printed circuit board layout As increasing processor speeds require more and more from memory, designers´ path to lower latency lies through informed board layout that minimizes performance issues such as power supply jitter, reflections and crosstalk.… Read Article | More Articles View a Video-on-Demand On the Trail of Counterfeit Chips Counterfeit Chips costs the semiconductor manufacturers billions of dollars in lost revenue every year. Using SI’s Foundry Identification Services companies can track down the source of these chips. … View VOD | More VOD's