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Press ReleaseSemiconductor Insights Awards Texas Instruments OMAP Processor the 2003 INSIGHT Award for Most Innovative SoCFOR IMMEDIATE RELEASE: OTTAWA, May 15, 2003 Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and structures, today announced that it has awarded Texas Instruments Incorporated (TI) with the 2003 INSIGHT Award for Most Innovative System-on-a-Chip (SoC) for the OMAP710 processor. "TI’s OMAP710 device is the first applications processor to integrate a GSM/GPRS modem making it the most complete smart phone chipset reference design available," said Derek Nuhn, Chief Operating Officer of Semiconductor Insights. "The OMAP710 processor leverages TI’s communications expertise. Other players in this space like Intel know transistors, but they lack the analog, RF, and power management experience to make a leading smart phone / single-chip Bluetooth subsystem."TI has announced five new OMAP processors this year, each targeted to a specific application. The 7xx series is targeted directly at the smart phone and wireless PDA market and is an extremely strong contender enabling such services as multimedia messaging, short video clip and Internet audio downloads, e-mail, real-time Web browsing and gaming. TI's OMAP710 processor incorporates a DSP-based GSM/GPRS digital baseband engine and an ARM9 microprocessor with integrated MMU and cache for complete modem and applications support. With a dedicated applications processor on a single chip that supports next generation bandwidth-intensive wireless applications, wireless device manufacturers are able to significantly reduce cost and form factors over current smart phones and PDA’s. The OMAP710 provides wireless device manufacturers with a complete ‘antenna-to-applications’ solution and enables optimal performance and power savings for 2.5G mobile devices. "The OMAP710 processor is the industry’s only solution integrating applications and voice processing to address manufacturers’ needs for reduced cost, design time and solution size." said Mike Yonker, Chief Technologist for TI’s Wireless Computing Products Division. "Our high-performance, low-power OMAP platform has already been selected by a wide variety of manufacturers, and we are pleased to be recognized for our technical success with this award." For a free TECHinsight on the device, visit www.semiconductor.com About Semiconductor Insights A Division of UBM For further information, contact: Jill Perry |
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