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Semiconductor Insights recognizes IBM with 2004 INSIGHT Award for Most Advanced ProcessRead our complimentary Insight Report: IBM PowerPC 970FX FOR IMMEDIATE RELEASE: OTTAWA, June 28, 2004 - Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and structures, today announced that it has awarded IBM with the 2004 INSIGHT Award for Most Advanced Process for the PowerPC 970FX. "IBM continues to lead the process envelope among its peers, consistently delivering on even the most ambitious roadmaps", said Dr. Lluis Paris, Director of TECHinsights for Semiconductor Insights. "The 970FX is the first device SI has analyzed at the 90nm node that leverages the cost and performance advantage offered by this advanced process. Other industry firsts attained by the 970FX include the combination of SOI, strained silicon, and copper wiring technologies." IBM's PowerPC 970FX is deployed by Apple Computer in their Xserve G5 systems and in IBM's eServer BladeCenters. The 970FX is billed as delivering higher performance and decreased power consumption achieved through a combination of strained silicon and SOI process. "IBM continues to be a strong proponent of SOI for reduced power consumption and we awarded this category to IBM last year for putting SOI into production with the PowerPC 750FX", said Paris. "IBM has taken the next step with the 970FX by adding strained silicon, clearly establishing IBM as the leader in overall microprocessor process technology." SI's preliminary analysis has confirmed the presence of ten levels of copper metallization — the most advanced interconnect system on the market. As well, this analysis reveals that the 970FX delivers a 50% die shrink (to 65mm²) over its 130nm predecessor, including the 6-T SRAM cell size. Finally, the 970FX has the most aggressively scaled transistor gate length at 48nm that SI has analyzed to date, close to IBM's specified 46nm. "We are pleased to be recognized for these efforts by Semiconductor Insights", said Dr. Bernard Meyerson, IBM Fellow and chief technologist, IBM Systems & Technology Group, "IBM's commitment to innovative technologies such as SOI and strained silicon have made the PowerPC 970FX an industry-leading microprocessor. We are proud to be delivering high performance Power Architecture products to the world's most demanding companies." IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum and faster silicon-on-insulator (SOI) and silicon germanium transistors. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for 11 consecutive years. More information about IBM semiconductors can be found at: http://www.ibm.com/chips. Read our complimentary Insight Report: IBM PowerPC 970FX (requires registration) ### About Semiconductor Insights — A Division of UBM Matt Dudley |
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